Resource Type

Journal Article 188

Conference Videos 3

Year

2023 14

2022 17

2021 19

2020 12

2019 15

2018 5

2017 6

2016 8

2015 21

2014 8

2013 4

2012 5

2011 8

2010 7

2009 4

2008 8

2007 4

2006 4

2005 5

2004 4

open ︾

Keywords

reliability 29

reliability analysis 6

semiconductor 5

multi-objective optimization 4

robust design 4

Reliability 3

reliability prediction 3

3D printing 2

Distributed storage system 2

monitoring 2

optimization design 2

reliability design 2

reliability sensitivity 2

reliability-based design optimization 2

reliability-based sensitivity analysis 2

slope stability 2

/III-V interface 1

12 inches 1

2035 1

open ︾

Search scope:

排序: Display mode:

New concept and procedure for reliability assessment of an IEC 61850 based substation and distributionautomation considering secondary device faults

Hosein HAYATI,Amir AHADI,Seyed Mohsen MIRYOUSEFI AVAL

Frontiers in Energy 2015, Volume 9, Issue 4,   Pages 387-398 doi: 10.1007/s11708-015-0382-6

Abstract: grid with advanced communication technologies can be used for several purposes such as efficiency and reliabilityThis paper proposes a novel method for reliability evaluation of modern substation and distribution systemsThe fault tree analysis (FTA) is used to quantify the reliability of the system.

Keywords: IEC 61850     reliability assessment     fault tree analysis    

Design and optimization of a gate-controlled dual direction electro-static discharge device for an industry-level Research Article

Yang WANG, Xiangliang JIN, Jian YANG, Feng YAN, Yujie LIU, Yan PENG, Jun LUO, Jun YANG,jinxl@hunnu.edu.cn,pengyan@shu.edu.cn

Frontiers of Information Technology & Electronic Engineering 2022, Volume 23, Issue 1,   Pages 158-170 doi: 10.1631/FITEE.2000504

Abstract: gate-controlled SCR (DNW-GCSCR) with a high failure level to effectively solve the problems based on the same semiconductorTechnology computer-aided design (TCAD) simulation is used to analyze the device characteristics.However, the failure current of the NBL-GCSCR device is 1.71 A, and the failure current of the DNW-GCSCRdevice is 20.99 A.

Keywords: Electric breakdown     Semiconductor device reliability     CMOS technology    

Recent advances of hydrogen production through particulate semiconductor photocatalytic overall water

Frontiers in Energy 2022, Volume 16, Issue 1,   Pages 49-63 doi: 10.1007/s11708-022-0817-9

Abstract: Solar energy-driven photocatalytic water splitting has been investigated for decades to produce clean and renewable green hydrogen. In this paper, the cutting-edge research within the overall water splitting system is summarized from the one-step photocatalytic overall water splitting (POWS) system to the two-step system and the cocatalysts research in this field. In addition, the photocatalytic reaction engineering study is also reviewed which is crucial for future scale-up. This mini-review provides a picture of survey of recent progress of relevant overall water splitting system, with particular attention paid to material system and mechanistic breakthroughs, and highlights the challenge and opportunity of the current system.

Keywords: photocatalysis     overall water splitting     hydrogen    

Advantageous mechanochemical synthesis of copper(I) selenide semiconductor, characterization, and properties

Frontiers of Chemical Science and Engineering 2022, Volume 16, Issue 3,   Pages 433-442 doi: 10.1007/s11705-021-2066-6

Abstract: Copper(I) selenide-nanocrystalline semiconductor was synthesized via one-step mechanochemical synthesis

Keywords: Cu2Se     berzelianite     nanocrystalline semiconductor     mechanochemical synthesis     planetary ball    

Liquid metal printing opening the way for energy conservation in semiconductor manufacturing industry

Frontiers in Energy 2022, Volume 16, Issue 4,   Pages 542-547 doi: 10.1007/s11708-022-0834-8

Strategic Study on the Development of Advanced Semiconductor Materials and Auxiliary Materials in China

Writing Group of Advanced Semiconductor Materials and Auxiliary Materials

Strategic Study of CAE 2020, Volume 22, Issue 5,   Pages 10-19 doi: 10.15302/J-SSCAE-2020.05.002

Abstract:

The rapid development of the third-generation semiconductor materialsSiC and GaN offers China a strategic opportunity to realize the independent control over its advanced semiconductorIn this paper, we analyze the development status of semiconductor materials and auxiliary materials inTo promote the development of advanced semiconductor materials and auxiliary materials in China, we suggestTo promote the innovative development of the semiconductor industry,China should adhere to government

Keywords: advanced semiconductor materials     auxiliary materials     third-generation semiconductor     2035    

Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability Article

Xuejun Fan,Liangbiao Chen,C. P. Wong,Hsing-Wei Chu,G. Q. Zhang

Engineering 2015, Volume 1, Issue 3,   Pages 384-390 doi: 10.15302/J-ENG-2015034

Abstract:

Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as highvapor pressure can cause device failures in environments with high temperature and humidity.The underlying mechanism of SH coating for enhancing device reliability, however, is still not fullyHowever, when a device was coated with an SH nanocomposite, weight gain was still observed, likely dueSuch a theory could greatly improve microelectronics reliability.

Keywords: vapor pressure     moisture     semiconductor reliability     microelectromechanical systems (MEMS)     super-hydrophobic    

Novel slack-based robust scheduling rule for a semiconductor manufacturing system with uncertain processing

Juan LIU, Fei QIAO, Yumin MA, Weichang KONG

Frontiers of Engineering Management 2018, Volume 5, Issue 4,   Pages 507-514 doi: 10.15302/J-FEM-2018045

Abstract:

The NP-hard scheduling problems of semiconductor manufacturing systems (SMSs) are further complicated

Keywords: semiconductor manufacturing system     uncertain processing time     dynamic scheduling     slack-based robust scheduling    

Developments in semiconductor thermoelectric materials

Laifeng LI, Zhen CHEN, Min ZHOU, Rongjin HUANG

Frontiers in Energy 2011, Volume 5, Issue 2,   Pages 125-136 doi: 10.1007/s11708-011-0150-1

Abstract: The objectives of this paper are to introduce the recent developments in semiconductor thermoelectric

Keywords: thermoelectric materials     thermoelectric figure of merit     applications    

Efficient detection methods for amplify-and-forward relay-aided device-to-device systems with full-rate Article

Kang-li ZHANG, Cong ZHANG, Fang-lin GU, Jian WANG

Frontiers of Information Technology & Electronic Engineering 2017, Volume 18, Issue 6,   Pages 788-795 doi: 10.1631/FITEE.1700018

Abstract: Relay-aided device-to-device (D2D) communication is a promising technology for the next-generation cellular

Keywords: Device-to-device     Relay     Detection     Full-rate space-time block code    

Ga(X)N/Si nanoarchitecture: An emerging semiconductor platform for sunlight-powered water splitting toward

Frontiers in Energy doi: 10.1007/s11708-023-0881-9

Abstract: materials developed, Ga(X)N/Si (X = In, Ge, Mg, etc.) nanoarchitecture has emerged as a disruptive semiconductorMoreover, it describes the challenges and prospects of artificial photosynthesis integrated device and

Keywords: Ga(X)N/Si nanoarchitecture     artificial photosynthesis     water splitting     solar toward hydrogen    

Current status and prospects of reliability systems engineering in China

Frontiers of Engineering Management 2021, Volume 8, Issue 4,   Pages 492-502 doi: 10.1007/s42524-021-0172-2

Abstract: This study provides a systematic overview of the advent and evolution of reliability systems engineering

Keywords: reliability     effectiveness     model-based systems engineering     reliability systems engineering    

Design method and verification of a hybrid prosthetic mechanism with energy-damper clutchable device

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 4,   Pages 747-764 doi: 10.1007/s11465-021-0644-4

Abstract: Inspired by motion–energy coupling relationship of the knee, a wearable energy-damper clutched device

Keywords: hybrid transfemoral prosthetic mechanism     energy recycling     wearable mechanical clutched device     mechanical    

Human reliability in maintenance task

Pacaiova HANA,

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 2,   Pages 184-188 doi: 10.1007/s11465-010-0002-4

Abstract: The importance of considering the reliability of maintenance tasks and the method to reach it are also

Keywords: maintenance     risk assessment     failure     reliability     prevention    

Experiment and optimal design of a collection device for a residual plastic film baler

Qi NIU,Xuegeng CHEN,Chao JI,Jie WU

Frontiers of Agricultural Science and Engineering 2015, Volume 2, Issue 4,   Pages 347-354 doi: 10.15302/J-FASE-2015077

Abstract: The collection device is a core component of the baler.

Keywords: residual film     collection device     collection rate of residual film     impurity of film package     optimization    

Title Author Date Type Operation

New concept and procedure for reliability assessment of an IEC 61850 based substation and distributionautomation considering secondary device faults

Hosein HAYATI,Amir AHADI,Seyed Mohsen MIRYOUSEFI AVAL

Journal Article

Design and optimization of a gate-controlled dual direction electro-static discharge device for an industry-level

Yang WANG, Xiangliang JIN, Jian YANG, Feng YAN, Yujie LIU, Yan PENG, Jun LUO, Jun YANG,jinxl@hunnu.edu.cn,pengyan@shu.edu.cn

Journal Article

Recent advances of hydrogen production through particulate semiconductor photocatalytic overall water

Journal Article

Advantageous mechanochemical synthesis of copper(I) selenide semiconductor, characterization, and properties

Journal Article

Liquid metal printing opening the way for energy conservation in semiconductor manufacturing industry

Journal Article

Strategic Study on the Development of Advanced Semiconductor Materials and Auxiliary Materials in China

Writing Group of Advanced Semiconductor Materials and Auxiliary Materials

Journal Article

Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability

Xuejun Fan,Liangbiao Chen,C. P. Wong,Hsing-Wei Chu,G. Q. Zhang

Journal Article

Novel slack-based robust scheduling rule for a semiconductor manufacturing system with uncertain processing

Juan LIU, Fei QIAO, Yumin MA, Weichang KONG

Journal Article

Developments in semiconductor thermoelectric materials

Laifeng LI, Zhen CHEN, Min ZHOU, Rongjin HUANG

Journal Article

Efficient detection methods for amplify-and-forward relay-aided device-to-device systems with full-rate

Kang-li ZHANG, Cong ZHANG, Fang-lin GU, Jian WANG

Journal Article

Ga(X)N/Si nanoarchitecture: An emerging semiconductor platform for sunlight-powered water splitting toward

Journal Article

Current status and prospects of reliability systems engineering in China

Journal Article

Design method and verification of a hybrid prosthetic mechanism with energy-damper clutchable device

Journal Article

Human reliability in maintenance task

Pacaiova HANA,

Journal Article

Experiment and optimal design of a collection device for a residual plastic film baler

Qi NIU,Xuegeng CHEN,Chao JI,Jie WU

Journal Article